Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Reexamination Certificate
2004-11-05
2009-12-15
Ward, Jessica L. (Department: 1793)
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
C228S008000, C228S103000, C228S104000, C228S180500, C716S030000
Reexamination Certificate
active
07631795
ABSTRACT:
A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.
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Jung Suk-Chun
Kim Byung-Soo
Kim Tae-Hyuk
Kwon Young-Han
Oh Kook-Jin
Aboagye Michael
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
Ward Jessica L.
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