Metal deforming – With tool carrier – With guide for rectilinearly moving tool
Reexamination Certificate
2005-10-04
2005-10-04
Jones, David (Department: 3725)
Metal deforming
With tool carrier
With guide for rectilinearly moving tool
C072S420000, C228S165000, C228S174000, C324S754090, C324S761010, C257S738000, C257S778000
Reexamination Certificate
active
06951125
ABSTRACT:
A system and method is disclosed for aligning an integrated circuit die on an integrated circuit substrate. A plurality of deposits of deformable material are placed on the substrate where the integrated circuit die is to be aligned. In one advantageous embodiment a stamping tool is indexed to a first tooling hole and to a second tooling hole in the substrate. The stamping tool imprints the deposits of deformable material to a tolerance of less than one hundred microns with respect to the first and second tooling holes. The imprinted portions of the deposits a form a pocket for receiving the integrated circuit die. This enables the integrated circuit die to be precisely aligned on the substrate in three dimensions.
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Chiu Anthony M.
Siegel Harry Michael
Jones David
Jorgenson Lisa K.
Munck William A.
STMicroelectronics Inc.
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