Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Reexamination Certificate
2007-01-09
2007-01-09
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
C257S048000, C257S777000, C257S778000, C438S014000, C361S759000, C361S801000, C324S252000, C324S719000, C324S765010
Reexamination Certificate
active
11133999
ABSTRACT:
A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC board. In one embodiment, the IC package includes a first power plane along with a power carrier and one or more pin receptacles. The power bar carrier includes a first conducting panel that is electrically coupled to the first power plane along a first adjacent edge. The first conducting panel is also electrically coupled to a first plurality of conducting pads.
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Stone Brent
Xie Hong
Jr. Carl Whitehead
Mitchell James
LandOfFree
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