Synchronous modulation bias sputter method and apparatus for com

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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20419212, 20419215, 20429803, 20429806, 20429808, 20429809, C23C 1434

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056393571

ABSTRACT:
A method for producing planarized metal films on a substrate which includes the steps of depositing a thin film of a metal onto the substrate; after the thin film is deposited, generating vacancies in the deposited thin film of metal to increase the mobility of the metal atoms of the deposited thin film; after generating vacancies within the deposited thin film of metal and before depositing any more metal, heating the surface of the deposited thin film to cause a reflow of the metal in the thin metal film; and repeating the above sequence of steps until a metal layer is formed having a predetermined thickness.

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patent: 5108570 (1992-04-01), Wang
patent: 5175608 (1992-12-01), Nihei et al.
"Significant Improvement in Step Coverage Using Bias Sputtered Aluminum" (Skelly/Gruenke) J.Vac.Sci.Technol. A4(3), May 6/Jun. 1986, pp. 457-160.

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