Static information storage and retrieval – Read/write circuit – Signals
Reexamination Certificate
2000-03-24
2001-12-04
Nelms, David (Department: 2818)
Static information storage and retrieval
Read/write circuit
Signals
C365S233100
Reexamination Certificate
active
06327196
ABSTRACT:
TECHNICAL FIELD
This invention relates to clocked integrated circuits that deliver data, and more particularly to a method and apparatus for adjusting the timing of data presented to an output terminal relative to a clock signal.
BACKGROUND OF THE INVENTION
Clock signals are used by a wide variety of digital circuits to control the timing of various events occurring during the operation of the digital circuits. For example, clock signals are used to designate when command signals, data signals, and other signals used in memory devices and other computer components are valid and can thus be used to control the operation of the memory device or computer system. For instance, a clock signal can be used to develop sequential column addresses when an SDRAM is operating in burst mode.
Retrieving valid data from a clocked memory device at a specified time can be difficult to coordinate. After a memory address is selected, the data travels out of the selected memory cell, is amplified, passes through configuration circuitry (if the memory chip has multiple configurations) and passes through an output buffer before the data is read. Before the advent of synchronous memory circuits, data simply appeared at an output terminal following a propagation delay after the data was requested. In a synchronous memory circuit, data delivery is synchronized with a clock signal. Many circuits have been created to coordinate data signals with clock signals, with varying degrees of success. Two of the problems to solve are determining how fast and with what regularity the data signal propagates through the chip circuitry. Because data output is often coordinated with a clock signal that is external to the memory chip, computer simulations of signal propagation within a chip are performed to align the external clock signal with the data delay of the synchronous memory device. Static time delays are then designed into the memory circuit based on the simulation predictions. Because of production variations, improper assumptions, and other factors ultimately causing timing errors, the data does not always arrive at the output terminal at the desired time. As computer clock speeds increase, the window for providing valid data to the output terminal closes, making it more difficult to ensure the correct delivery time of data from the memory circuit.
An example of a circuit that provides data to a data pad at a specific time relative to an external clock is shown in FIG. 
1
. An output circuit 
2
 includes a memory array 
5
 that contains an array of individual memory cells (not shown). Once a particular memory cell is selected to be read, complementary signals corresponding to the contents of the memory cell travel to a pair of respective I/O and I/O* lines. The signals on the I/O and I/O* lines are sensed and amplified by a data sensing circuit 
10
, which produces a DATA* signal at an output. An external clock signal is received at a clock circuit input 
7
 and passes through clock circuitry 
15
 to become a CLKDOR* signal. The CLKDOR* signal may differ from the external clock signal in a variety of ways, including phase, orientation, and duty cycle, however, their overall periodic cycle length is the same. Oftentimes, to properly match timing of the data arriving at the data pad with the external clock signal, a static delay is added within the clock circuitry 
15
.
The DATA* signal is presented to a passgate 
20
 and passed to an output node 
21
 when the signal CLKDOR* signal is HIGH and its complement from an inverter 
17
 is LOW. From the output node 
21
, the DATA* signal is input to a NOR gate 
30
 along with a TRISTATE signal. An output from the NOR gate 
30
 leads to a passgate 
24
. When the CLKDOR* signal is LOW and its complement from the inverter 
17
 is HIGH, the output from the NOR gate 
30
 passes through the passgate 
24
 and becomes the signal DQHI. Another NOR gate 
32
 combines the output of the NOR gate 
30
 with the TRISTATE signal. This output from the NOR gate 
32
 is presented to a pair of passgates 
22
, 
26
. The passgate 
22
 receives the signal from the NOR gate 
32
 and, when the CLKDOR* signal is LOW and its complement from the inverter 
17
 is HIGH, feeds it back to the output node 
21
. The passgate 
26
 passes the signal it receives from the NOR gate 
32
 as an output signal DQLO when the signal CLKDOR* is LOW and its complement from the inverter 
17
 is HIGH.
If the signal DQHI is HIGH, a pull-up circuit 
36
 raises a DQ pad 
40
 to a HIGH voltage. Conversely, if DQLO is HIGH, it activates a pull-down circuit 
38
 to pull the DQ pad 
40
 to a ground voltage. The output circuit 
2
 is designed so that the pull-up circuit 
36
 and the pull-down circuit 
38
 cannot operate simultaneously. When neither the pull-up circuit 
36
 nor the pull-down circuit 
38
 is active, the DQ pad 
40
 is neither pulled up to a HIGH voltage nor pulled down to ground, but instead remains in a high-impedance state.
The circuit operation of the data delivery circuit 
2
 will now be explained. When the CLKDOR* signal is HIGH and the DATA* signal is HIGH, a HIGH signal passes to the output node 
21
. Assuming that the TRISTATE signal is low to enable the NOR gates 
30
 and 
32
 so they act as inverters, when the CLKDOR* signal goes LOW, the passgate 
22
 couples the output of the NOR gate 
32
 to the input of the NOR gate 
30
, output node 
21
. The NOR gates 
30
 and 
32
 then latch the HIGH at the output node 
21
 to the output of the NOR gate 
32
. At the same time, a LOW is latched to the output of the NOR gate 
30
. The HIGH at the output of the NOR gate 
32
 is coupled through the passgate 
26
 to the pull-down circuit 
38
. The HIGH signal DQLO causes the pull-down circuit 
38
 to pull the DQ pad 
40
 to ground. At the same time, the LOW signal at the output of the NOR gate 
30
 passes through the passgate 
24
. The LOW DQHI signal does not activate the pull-up circuit 
36
, as explained above. Alternatively, if the DATA* signal is LOW, a LOW signal is passed to the output node 
21
 when the CLKDOR* signal is HIGH. When the CLKDOR* signal drops LOW, the LOW signal at the output node 
21
 is latched by the NOR gates 
30
 and 
32
, is fed back to the output node 
21
 through the passgate 
22
, and also propagates through the passgate 
26
 to make DQLO LOW. Concurrently, the LOW signal at the data output node 
21
 causes the NOR gate 
30
 to output a HIGH signal that passes through the passgate 
24
 to provide a HIGH DQHI signal. The HIGH DQHI signal causes the pull-up circuit 
36
 to connect the DQ pad 
40
 to a HIGH voltage. If the TRISTATE signal is HIGH, neither DQHI nor DQLO will be HIGH regardless of the state of the DATA* signal. Thus, the DQ pad 
40
 floats in a high impedance state.
When a computer system is designed, specifications for signal timing are determined. Some of the signals and timings used in the design are shown in FIG. 
2
. One of the design specifications is an access time, T
AC
, used to designate a maximum time between a rising edge of an external clock signal and when a valid data signal arrives at the DQ pad 
40
. Additionally, another specified time parameter is the output hold time, T
OH
, indicative of a minimum time for how long the data will be held at the DQ pad 
40
 following a subsequent rising edge of the external clock. For example, as illustrated in 
FIG. 2
, a READ command signal is input to a memory circuit sometime between a rising edge of a clock pulse CP
0
 and a clock pulse CP
1
. At a time CP
1
, the READ command is latched and read by the memory circuit, indicating data is to be read from a memory cell in a memory array. The data is read from the array and placed at the DQ pad 
40
 under the control of the CLKDOR* signal. The specification T
AC 
indicates a maximum time until the desired data is placed on the DQ pad 
40
. The data is held at the DQ pad 
40
 for a time no less than the specification T
OH
, as measured from a subsequent clock pulse after the READ command is latched. As shown in 
FIG. 2
, T
AC1 
is the time measured from CP
2
 until
Dorsey & Whitney LLP
Micro)n Technology, Inc.
Nelms David
Tran M.
LandOfFree
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