Symmetrical circuit arrangement for a X-Y matrix electrode

Details Symmetrical circuit arrangement for a X-Y matrix electrode Symmetrical circuit arrangement for a X-Y matrix electrode

1991-02-20

1992-08-11

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228190, 228254, 228 447, H05K 334, H01L 21603

Patent

active

051372053

ABSTRACT:
A wiring circuit substrate comprises first circuit element means one one side of the substrate connected to electrode lines of X-Y matrix electrodes, respectively, and second circuit element means in the symmetrical position of the first circuit element means on the other side of the substrate connected to the electrode lines of the X-Y matrix electrodes, respectively, wherein each of leads of the first and the second circuit element means is connected to the output and input lines of the X-Y matrix electrodes via through holes, respectively.
The first circuit element comprises integrated transisitors for driving the X-Y matrix electrodes. The second circuit element comprises integrated diodes for protecting an overcurrent in the X-Y matrix electrodes.

REFERENCES:
patent: 3296692 (1963-09-01), Griffin
patent: 3387365 (1968-06-01), Stelmak
patent: 3555364 (1971-01-01), Matcovich
patent: 3589591 (1971-06-01), Schwenn
patent: 3705332 (1972-12-01), Parks
patent: 3883945 (1975-05-01), Wallis
patent: 3914850 (1975-10-01), Coucoulas
patent: 4050618 (1977-09-01), Angelucci et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4345371 (1982-08-01), Ohsawa et al.
patent: 4371912 (1983-02-01), Guzik
"High Density and Speed Performance Chip Joining Procedure and Package"-Iafrate-IBM Tech Disclosure Bulletin-vol. 15, No. 4, Sep. 1972, p. 1282.

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