Coating apparatus – Gas or vapor deposition – With treating means
Patent
1993-11-29
1995-06-06
Bueker, Richard
Coating apparatus
Gas or vapor deposition
With treating means
118729, 118730, C23C 1600
Patent
active
054218934
ABSTRACT:
A thermal reaction chamber for semiconductor wafer processing operations comprising:
(i) a susceptor for supporting a semiconductor wafer within the chamber and having a plurality of apertures formed vertically therethrough;
(ii) displacer means for displacing the susceptor vertically between at least a first and a second position;
(iii) a plurality of wafer support elements, each of which is suspended to be vertically moveable within said apertures and each of which extends beyond the underside of the susceptor; and
(iv) means for restricting the downward movement of the wafer support elements. As the susceptor is displaced from its first position through an intermediate position before the second position, the means for restricting operate to stop the continued downward movement of the wafer support elements thereby causing the elements to move vertically upwards with respect to the downwardly moving susceptor and separate the wafer from the susceptor.
REFERENCES:
patent: 4724621 (1988-02-01), Hobson
patent: 5000113 (1991-03-01), Wang
patent: 5044943 (1991-09-01), Bowman
patent: 5094885 (1992-03-01), Selbrede
patent: 5117769 (1992-06-01), de Boer
patent: 5135635 (1992-08-01), Ikeda
Applied Materials Inc.
Bueker Richard
Opperman Craig P.
Sgarbossa Peter J.
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