Surface treatment method

Details Surface treatment method Surface treatment method

1988-06-01

1989-11-14

Nguyen, Nam X.

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419215, 204298, C23C 1434

Patent

active

048805157

ABSTRACT:
A substrate is surface treated by a sputtering process by placing the substrate between a pair of targets which are located at a predetermined spacing in a sputtering apparatus, driving atoms out of both the targets, and depositing the atoms on the substrate to form a film thereon.

REFERENCES:
patent: 3627663 (1971-12-01), Davidse et al.
patent: 3979273 (1976-09-01), Panzera et al.
patent: 4031424 (1977-06-01), Penfold et al.
patent: 4411763 (1983-10-01), Itaba et al.
patent: 4444635 (1984-04-01), Kobayashi et al.
patent: 4500407 (1985-02-01), Boys et al.
patent: 4544468 (1985-10-01), Munz et al.
patent: 4663009 (1987-05-01), Bloomquist et al.

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