Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2008-04-03
2010-11-09
Ho, Tu-Tu V (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S752000, C257S759000, C257S768000, C257SE23162, C257SE21593, C438S650000, C438S686000
Reexamination Certificate
active
07830010
ABSTRACT:
Interconnect structures in which a noble metal-containing cap layer is present directly on a non-recessed surface of a conductive material which is embedded within a low k dielectric material are provided. It has been determined that by forming a hydrophobic surface on a low k dielectric material prior to metal cap formation provides a means for controlling the selective formation of the metal cap directly on the non-recessed surface of a conductive material. That is, the selective formation of the metal cap directly on the non-recessed surface of a conductive material is enhanced since the formation rate of the metal cap on the non-recessed surface of a conductive material is greater than on the hydrophobic surface of the low k dielectric material. It is observed that the hydrophobic surface may be a result of treating a damaged surface of the dielectric material with a silylating agent prior to the selective formation of the noble metal cap or, as a result of forming a hydrophobic polymeric layer on the surface of the dielectric material prior to the selective deposition of the noble metal cap. The hydrophobic polymeric layer typically includes atoms of Si, C and O.
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U.S. Appl. No. 12/021,316, entitled “Noble Metal Cap for Interconnect Structures,” filed on Jan. 29, 2008, first named inventer: Chih-Chao Yang.
Nitta Satya V.
Purushothaman Sampath
Sankarapandian Muthumanickam
Yang Chih-Chao
Ho Tu-Tu V
International Business Machines - Corporation
Percello, Esq. Louis J.
Scully , Scott, Murphy & Presser, P.C.
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