Surface treatment for ceramics to eliminate alpha particle emitt

Details Surface treatment for ceramics to eliminate alpha particle emitt Surface treatment for ceramics to eliminate alpha particle emitt

1983-07-14

1984-05-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

65 31, 156663, 156667, B44C 122, C03C 1500, C03C 2506

Patent

active

044459688

ABSTRACT:
A method of treating ceramic materials used in semiconductor packaging applications to reduce their emission of alpha particles. Ceramic materials made of aluminum oxide particles bonded together with a siliceous binding material, are etched to remove the siliceous material from a surface portion of the ceramic. Since the typically used siliceous materials have alpha particle emitting elements in them by removing this siliceous material from a surface layer of the ceramic material the sources of alpha particles which are most likely to cause failures in electronic devices are removed. Alpha particle sources deeper in the ceramic pose a far lesser threat to the device because these relatively low energy, high volume particles suffer a substantial attenuation as they pass through aluminum oxide particles.

REFERENCES:
Article by James A. Woolley et al. entitled "Low Alpha-Particle-Emitting Ceramics: What's the Lower Limit?", Published in IEEE Transactions on Components, Hybrids, . . . vol. CHMT-2, No. 4, Dec. 1979, pp. 388-390.
Article by H. P. Gibbons et al. entitled "Alpha Particle Emissions of Some Materials in Electronic Packages", Published in IEEE 29th, 1979, pp. 257-260.

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