Surface-treating agents for copper and copper alloy

Compositions – Etching or brightening compositions – Inorganic acid containing

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252 792, 156666, 156903, B08B 308

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active

050303732

ABSTRACT:
An aqueous solution containing 0.1 g/l or more of piperidine or a derivative, 100-500 g/l of sulfuric acid, 10-50 g/l of hydrogen peroxide and 0.5 g/l or more of phosphoric acid is used for treating the surface of copper or copper alloy used in manufacturing of printed circuit.

REFERENCES:
patent: 4040863 (1977-08-01), Kitamura
patent: 4636368 (1987-01-01), Pralus
patent: 4929301 (1990-05-01), Beechko
Hoeg et al., "Metallic Free Organic Aluminum Etchant", IBM Tech. Discl. Bulletin, vol. 15, No. 1, Jun. 1972.

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