Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-05-12
2009-12-08
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S964000, C438S121000, C438S122000, C257SE21499
Reexamination Certificate
active
07629204
ABSTRACT:
A surface roughening method for an embedded semiconductor chip structure is proposed. The method includes providing a carrier board with an opening and mounting a semiconductor chip in the opening of the carrier board, the semiconductor chip having a plurality of electrode pads; and performing a surface roughening process on a surface of the electrode pads of the semiconductor chip, so as to form a rough structure on a surface of the semiconductor chip exposed by the opening of the carrier board. Thus, adhesion between the chip and a dielectric layer is improved during subsequently forming circuit build-up layers on the roughened surface of the semiconductor chip and on the surface of carrier board.
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Birch & Stewart Kolasch & Birch, LLP
Phoenix Precision Technology Corporation
Zarneke David A
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