Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2006-08-01
2006-08-01
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S785000
Reexamination Certificate
active
07084516
ABSTRACT:
A surface protection film which comprises a substrate layer and an adhesive layer, and of which the electrostatic charge by peeling from an adherend is from +0.01 to −0.01 nC/mm2.
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Shimizu Mikio
Takei Atsushi
Tokunaga Hisatsugu
Denki Kagaku Kogyo Kabushiki Kaisha
Nelms David
Nguyen Thinh T
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