Coating processes – With cutting – holding – severing – or abrading the base – Prior to coating
Patent
1998-03-17
1999-06-08
Bareford, Katherine A.
Coating processes
With cutting, holding, severing, or abrading the base
Prior to coating
427453, 427427, 427444, 427421, 451 38, 451 39, B05D 312
Patent
active
059103388
ABSTRACT:
The present invention discloses a surface structure and a method for preparation of the structure. The surface structure comprises a dielectric material in intimate contact with an underlying material having undercut formations therein which enhance the adhesion of the dielectric material to the surface of the underlying material. Preferred applications for the surface structure include semiconductor processing apparatus such as process chamber interior surfaces and the surfaces of functional elements used within the chamber. Functional elements include an electronic chuck used to hold a semiconductor substrate in place within the process chamber. The surface structure comprises at least one, and preferably a plurality of undercut formations which facilitate mechanical locking of a dielectric layer applied thereover. Preferably the undercut formation is at least one groove which traverses the surface to which the dielectric material is to be applied. The precise shape of the undercut formation (groove) depends upon the dielectric material which is to be applied to the surface structure, since the dielectric material must be capable of making intimate contact with the surface of the structure. Particularly for high temperature applications, ceramic materials are the dielectric material of choice. The most commonly used material for the interior of semiconductor processing chambers and functional elements used therein is aluminum or an aluminum-comprising alloy.
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Applied Materials Inc.
Bareford Katherine A.
Church Shirley
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