Surface-mounting type of electronic circuit unit suitable...

Details Surface-mounting type of electronic circuit unit suitable... Surface-mounting type of electronic circuit unit suitable...

2005-05-17

2005-05-17

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S666000, C257S678000, C257S690000, C257S703000, C257S705000, C257S787000

Reexamination Certificate

active

06894373

ABSTRACT:
Thin film circuit elements including capacitors, resistors, and inductance elements are formed on a large substrate, and semiconductor chips are wire bonded to the substrate. The elements and chips are sealed by potting a sealing resin. The large substrate is divided into multiple stripe substrates by dicing and a thin-film conductive layer is sputtered on cut surfaces of the stripe substrates, thereby electrically connecting edges of lower conductive patterns to edges of upper conductive patterns exposed from side surfaces of the sealing resin through the thin-film conductive layer. A Ni foundation layer and Au layer are successively plated on a surface of the thin-film conductive layer to form edge electrodes on side surfaces of the stripe substrates and the stripe substrates are divided finely into individual alumina substrates.

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patent: 2001-339033 (2001-12-01), None

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