Surface mounted device type package using coaxial cable

Details Surface mounted device type package using coaxial cable Surface mounted device type package using coaxial cable

2006-04-11

2006-04-11

Gushi, Ross (Department: 2833)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

Reexamination Certificate

active

07025845

ABSTRACT:
A surface mounted device (SMD) package using coaxial cables and a method of manufacturing the SMD by forming green sheets and selecting portions for mounting the coaxial cables on the green sheets and forming holes in the portions selected, stacking and heating the green sheets having the holes, and inserting the coaxial cables into the holes of the green sheets. The SMD includes a device mounting unit formed in the package for mounting a high frequency electronic device which transmits and receives high frequency signals, transmission lines electrically connected to the high frequency electronic device, and the coaxial cables penetrating internal and external portions of the package and including internal lead wires which contact the transmission lines. The SMD package is formed to conveniently transfer high frequency signals without the signal transfer loss.

REFERENCES:
patent: 4153988 (1979-05-01), Doo
patent: 5323534 (1994-06-01), Iwasaki et al.
patent: 6588097 (2003-07-01), Nishide et al.
patent: 11-186427 (1999-07-01), None

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