Surface mountable semiconductor device having self loaded solder

Details Surface mountable semiconductor device having self loaded solder Surface mountable semiconductor device having self loaded solder

1992-10-21

1994-07-12

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257736, 257772, 257787, 257779, 257781, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053291581

ABSTRACT:
An improved semiconductor device is disclosed having a predetermined amount of solder, or other electrically conductive binder adsorbed onto the exterior package leads of the semiconductor device. A de-wettable coating comprising preferably nickel, or alternatively chromium, is plated to a superior portion of the package leads, such that, when the heat is applied to the substrate mounting end of the leads, solder desorbes from the de-wettable layer and flows down the lead to the contact pads on the mounting substrate and forms a solder joint. The amount of solder delivered to the contact pad for joint formation is determined by the thickness of the adsorbed solder layer overlying each package lead. Only enough solder is provided on each lead sufficient to form the joint thus avoiding solder bridging between adjacent contact pads.

REFERENCES:
patent: 4661887 (1987-04-01), Lin
patent: 4673967 (1987-06-01), Hingorany
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4722470 (1988-02-01), Johary

Affiliated with

Also associated with

Rating

Surface mountable semiconductor device having self loaded solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface mountable semiconductor device having self loaded solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mountable semiconductor device having self loaded solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-398769