Surface-mountable semiconductor component and method for...

Details Surface-mountable semiconductor component and method for... Surface-mountable semiconductor component and method for...

2007-04-03

2007-04-03

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S731000, C257S773000, C257S775000, C257SE33058, C257SE23104, C257S099000, C257S100000

Reexamination Certificate

active

11052712

ABSTRACT:
Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip (1), and an encapsulation material (50). The two external electrical connections are arranged at a film (2) having a thickness of less than or equal to 100 μm. The semiconductor chip (1) is fixed at a first main surface (22) of the film (2) and the encapsulation material (50) is applied on the first surface (22).

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“Surface Mount LED Lamp, Super Bright 0402”, p. 1-6, Fairchild Semiconductor Corp., Aug. 3, 2001.

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