Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate
2005-08-09
2005-08-09
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
C257S678000, C257S680000, C257S666000
Reexamination Certificate
active
06927482
ABSTRACT:
A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and leadouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.
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Bryzek Aniela
Dancaster John
Kim Woo-jin
Logan John
Clark Jasmine
Dykema Gossett PLLC
General Electric Company
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