Surface modification of organic materials to improve adhesion

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

156643, 156646, 20419237, C23C 1400

Patent

active

047159413

ABSTRACT:
A silicon-modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon-modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surface provides improved adhesion to other organic surfaces and to deposited metals. Improvements in methods for laminating organic surfaces and for depositing metals on organic surfaces which achieve improved adhesion are disclosed. Structures comprising laminated organic layers or metal deposited on organic surfaces which provide improved adhesion between the organic layers or between the metal and the organic surface are also disclosed.

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R. H. Wheater, et al., "Polymer Interlayer Adhesion Enhancements Through Plasma Surface Modification" published Oct. 1983 by Electrochemical Society.

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