Surface form measuring apparatus and stress measuring...

Optics: measuring and testing – Material strain analysis

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07612873

ABSTRACT:
In a stress measuring apparatus, reflected light of light emitted to a substrate through an objective lens is received by a light shielding pattern imaging part, to acquire an image of a light shielding pattern positioned at an aperture stop part of an optical system. A control part obtains gradient vectors of the substrate in a plurality of gradient vector measurement areas and surface form of the substrate on the basis of outputs of the light shielding pattern imaging part, to obtain a stress in a film formed on the substrate. Since light directed through the objective lens becomes approximately parallel rays of light on the substrate, measurement can be performed without focusing on each gradient vector measurement area and the surface form of the substrate can be obtained easily and rapidly. Consequently, it is possible to obtain a stress in the film formed on the substrate easily and rapidly.

REFERENCES:
patent: 2004/0075836 (2004-04-01), Horie et al.
patent: 2008/0075328 (2008-03-01), Sciammarella
patent: 2000-9553 (2000-01-01), None
patent: 2004-138519 (2004-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Surface form measuring apparatus and stress measuring... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface form measuring apparatus and stress measuring..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface form measuring apparatus and stress measuring... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4116353

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.