Surface contamination analyzer for semiconductor wafers,...

Details Surface contamination analyzer for semiconductor wafers,... Surface contamination analyzer for semiconductor wafers,...

2005-09-13

2005-09-13

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

With measuring or testing

C250S306000, C250S310000

Reexamination Certificate

active

06943043

ABSTRACT:
A semiconductor wafer is radiated with an electron beam so that the inelastic scattering takes place in the narrow region, and current flows out from the narrow region; the amount of current is dependent on the substance or substances in the narrow region so that the analyst evaluates the degree of contamination on the basis of the substance or substances specified in the narrow region.

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“An In-Line Contact and Via Hole Inspection Method Using Electron Beam Compensation Current”, Yamada et al., IEEE 1999, Doc. No. 0-7803-5413-3/99/, available from http://www.fabsol.com/us/images/library/21.pdf.

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