Surface acoustic wave apparatus

Details Surface acoustic wave apparatus Surface acoustic wave apparatus

2007-02-27

2007-02-27

Baumeister, B. William (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S777000, C257SE23061

Reexamination Certificate

active

10911983

ABSTRACT:
A SAW apparatus is provided capable of realizing a small size without adverse affect while mounting the active surfaces of the semiconductor integrated circuit and the surface acoustic wave element. The SAW apparatus comprises a semiconductor IC and a SAW element. The semiconductor IC is flip-chip mounted on a bottom of the package, a non-active surface of the SAW element is bonded to a non-active surface of the semiconductor IC by using an adhesive, and an electrode portion arranged in the active surface is wire-bonded to an electrode pattern formed on the side walls of the package by using wires.

REFERENCES:
patent: 6184463 (2001-02-01), Panchou et al.
patent: 6512302 (2003-01-01), Mess et al.
patent: 2002/0079567 (2002-06-01), Lo et al.
patent: 09-162691 (1997-06-01), None

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