Support device for a thin substrate of a semiconductor material

Details Support device for a thin substrate of a semiconductor material Support device for a thin substrate of a semiconductor material

1989-06-14

1990-11-20

Hille, Rolf

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297W, 20429809, 20429815, 357 74, 357 79, 118503, 269903, C25D 1708, C25D 1706, C25D 1704

Patent

active

049716760

ABSTRACT:
A support device for a thin substrate, notably in a semiconductor material, having the shape of a plate with a circular profile, including a platen provided with projecting fixed abutments against which bears the substrate, wherein the fixed abutments are disposed on said platen so as to define an open housing which the substrate is freely engaged. The platen includes a complementary movable abutment, adapted for retracting inside a recess formed in the platen thickness which allows for engagement of said substrate. Once said substrate has been placed in a position a contact is established with the fixed abutments bearing in a resilient way against the substrate edge holding it against the abutments.

REFERENCES:
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patent: 4769744 (1988-09-01), Neugebauer et al.
Patent Abstracts of Japan, vol. 7, No. 204 (E-197)[1349], Sep. 9, 1983; and JP-A-58 102 525 (Nippon Denki K.K.) Jun. 18, 1983.
Pat. Abstracts of Japan, vol. 12, No. 306 (C-522)[3153] 19 Aout 1988; & JP-A-63 79 964 (Ulvac Corp.) Apr. 9, 1988.

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