Supply pin rearrangement for an I.C.

Details Supply pin rearrangement for an I.C. Supply pin rearrangement for an I.C.

1991-08-02

1992-06-30

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 74, 174 524, 361421, H01L 2348

Patent

active

051268221

ABSTRACT:
An IC is provided with supply pins extending beyond the chip's encapsulation. The location of the supply pins is chosen so as to minimize the length of the associated bonding wires. Moreover the supply pins are located next to each other so as to reduce the effective inductance of the associated bonding wires. Output pins connected with on-chip buffers are located next to the supply pins so as to reduce the length of the buffer's supply lines, giving rise to a further reduction is inductive parasitic effects.

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