Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1999-04-08
2000-07-04
Diamond, Alan
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429809, 20429811, 20429802, 20419212, 20429803, 20429815, 118723R, 118728, 118641, 118666, 427569, 427570, C23C 1454
Patent
active
060833602
ABSTRACT:
A method of reducing particle generation from the thin coating deposited on the internal surfaces of a deposition chamber which undergoes temperature variation greater than 100.degree. C. comprising maintaining the temperature variation of the internal surfaces low enough during the process cycle to keep thermal expansion stresses between the coating and the surfaces under 500 MPa. For titanium nitride deposited on stainless steel, this means keeping temperature variations under approximately 70.degree. C. in a chamber that may be heated to over 350.degree. C. during a typical processing operation. Preferably, a supplemental heater is mounted behind the upper shield and controlled by a temperature sensitive element which provides feedback control based on the temperature of the upper shield.
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Eckelmeyer Kenneth H.
Hunter John A.
Ohlhausen James A.
Peebles Diane E.
Diamond Alan
Libman George H.
Sandia Corporation
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