Supercritical carbon dioxide to reduce line edge roughness

Details Supercritical carbon dioxide to reduce line edge roughness Supercritical carbon dioxide to reduce line edge roughness

2006-05-23

2006-05-23

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Processing feature prior to imaging

C430S322000

Reexamination Certificate

active

07049053

ABSTRACT:
Polymer aggregates in a photoresist layer may be dissolved or reduced in dimension by treatment with supercritical carbon dioxide. The supercritical carbon dioxide may be used before and/or after development of the photoresist. The SCCO2treatment causes swelling of the photoresist and may allow polymer aggregates in the photoresist to be dissolved. Controlled release of the carbon dioxide de-swells the photoresist, resulting in reduced line edge roughness of openings in the photoresist and reduced resistance of metal lines formed in the openings.

REFERENCES:
patent: 6358673 (2002-03-01), Namatsu
patent: 2004/0035021 (2004-02-01), Arena-Foster et al.

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