Superconductive device manufacturing method

Details Superconductive device manufacturing method Superconductive device manufacturing method

1996-03-25

1999-05-18

Goodrow, John L.

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

438798, C23F1/00

Patent

active

059048611

ABSTRACT:
A superconductive device manufacturing method is disclosed, which can prevent the characteristic deterioration on the processed surface, reduce the number of process steps, and thereby shorten the manufacturing time. The superconductive device manufacturing method comprises the steps of: forming a YBCO film (301) on a substrate (201); forming a mask pattern (302) on the formed YBCO film (301); and etching the YBCO film (301) by use of the formed mask pattern (302) and a plasma including at least oxygen plasma.

REFERENCES:
patent: 4333793 (1982-06-01), Litshitz et al.
patent: 5326746 (1994-07-01), Ohtani et al.
patent: 5374613 (1994-12-01), Noda et al.
patent: 5470791 (1995-11-01), Suguro et al.
patent: 5514247 (1996-05-01), Shan et al.
Proceedings of the 5th International Symposium On Superconductivity (ISS'92), Nov. 16-19, 1992, Kobe, "Characteristics of Thin Film YBCO Micro-Stripline Resonator by Laser Etching", Tsuyoshi Takenaka et al., pp. 1147-1150.
Hiroshi Sato et al., Jpn. J. Appln. Phys., Part 2, No. 8A, vol. 31, (1992) "Liquid-Nitrogen-Cooled Dry Etching of YBaCu0 Thin Films", pp. L 1044-L 1046.
Roland Barth et al., Appl. Phys. Lett. 63, (8), (1993), "Optimization of YBa.sub.2 Cu.sub.3 O.sub.7-.delta. submicrometer structure fabrication", pp. 1149-1151.

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