Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k
Patent
1989-01-30
1992-01-14
Ryan, Patrick J.
Superconductor technology: apparatus, material, process
High temperature , per se
Having tc greater than or equal to 150 k
505701, 505702, 505703, 505704, 428209, 428210, 428426, 428432, 428433, 428688, 428901, 428930, 361397, 174250, B32B 900
Patent
active
050810707
ABSTRACT:
A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.
REFERENCES:
patent: 4835039 (1989-05-01), Barringer et al.
CA 110 (26); 241227z Imanaka et al., SC glass ceramics glass composite Fujitsu 5-11-87.
Jap. Abs. No. 89-120089, Manf. of SC Circuit Board, Hitachi Chem. 5-12-89.
New Electronics, vol. 20, No. 10, May 12, 1987, "Superconductor Future Heats Up", by P. Judge, p. 30.
Imanaka Yoshihiko
Kamehara Nobuo
Machi Takato
Niwa Koichi
Suzuki Hitoshi
Fujitsu Limited
Ryan Patrick J.
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