Sucker for transferring packaged semiconductor device

Details Sucker for transferring packaged semiconductor device Sucker for transferring packaged semiconductor device

1999-05-26

2000-10-24

Cherry, Johnny D.

Handling: hand and hoist-line implements

Utilizing fluid pressure

Venturi effect

29743, B25J 1506

Patent

active

061355224

ABSTRACT:
A sucker for transferring packaged semiconductor devices is provided, which includes a position rod, an elastic buffer and a sponge. The position rod defines an air extraction channel in an axial direction thereof. The elastic buffer pad defines an aperture to hold an end of the position rod and a first air hole communicated with the aperture and the air extraction channel. The sponge is attached to the elastic buffer pad. The sponge defines a second air hole communicated with the first air hole. Therefore, when air is extracted through the air holes and air extraction channel, the sponge is provided with an absorbent force to securely catch a packaged semiconductor device.

REFERENCES:
patent: 4887351 (1989-12-01), Porterfield et al.
patent: 5207465 (1993-05-01), Rich
patent: 5456510 (1995-10-01), Coots et al.

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