Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-05-21
2011-11-01
Landau, Matthew (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21597
Reexamination Certificate
active
08048801
ABSTRACT:
A substrate with first and second main surfaces includes at least one channel extending from the first main surface to the second main surface. The at least one channel includes a first cross-sectional area at a first location and a second cross-sectional area at a second location. An electrically conductive first material is disposed in the at least one channel.
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Binder Florian
Dertinger Stephan
Hasler Barbara
Martin Alfred
Sommer Grit
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Kim Sun M
Landau Matthew
Qimonda AG
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