Substrate with built-in electronic component and method for...

Details Substrate with built-in electronic component and method for... Substrate with built-in electronic component and method for...

2011-08-09

2011-08-09

Patel, Ishwarbhai B (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07994431

ABSTRACT:
A substrate with built-in electronic components includes a substrate on which a first conductive pattern is formed; an electronic component mounted on the substrate; an insulting layer which is formed by stacking a plurality of resin layers including indifferent additive ratios an additive material for adjusting hardness; a second conductive pattern formed on the insulating layer; and a conductive post for connecting the first conductive pattern to the second conductive pattern.

REFERENCES:
patent: 6734542 (2004-05-01), Nakatani et al.
patent: 6855892 (2005-02-01), Komatsu et al.
patent: 2006-195918 (2006-07-01), None

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