Substrate used for fabrication of thick film circuit

Details Substrate used for fabrication of thick film circuit Substrate used for fabrication of thick film circuit

1990-02-05

1992-03-17

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428698, 428704, 428901, B32B 900

Patent

active

050967681

ABSTRACT:
An insulating substrate is used for fabrication of a thick film circuit and comprises a foundation of aluminum nitride and a surface film structure provided on the foundation, in which the foundation contains at least one oxidizing agent selected from the group consisting of an yttrium oxide and a calcium oxide ranging from 0.1% to 10% by weight for enhancing a stiffness of the foundation, and in which the surface film structure is of the multi-level surface film structure having a lower surface film of an aluminum oxide rapidly grown on the foundation in the presence of the oxidizing agent and an upper surface film containing a silicon oxide and a substance selected from the group consisting of a zirconium oxide, a titanium oxide and a boron oxide for enhancing the resistivity against a firing operation.

REFERENCES:
patent: 4659611 (1987-04-01), Iwase et al.
patent: 4732794 (1988-03-01), Hyde
patent: 4806334 (1989-02-01), Fujinaka et al.
patent: 4820593 (1989-04-01), Egerton et al.

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