Substrate treatment system, substrate treatment method, and...

Details Substrate treatment system, substrate treatment method, and... Substrate treatment system, substrate treatment method, and...

2007-01-26

2010-10-19

Walke, Amanda C. (Department: 1795)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S780000, C438S781000, C438S782000, C430S330000, C430S331000, C355S027000

Reexamination Certificate

active

07816276

ABSTRACT:
In the present invention, a plurality of heat treatment plates are provided side by side in a linear form on a base of a heat treatment apparatus in a coating and developing treatment system. In the heat treatment apparatus, three transfer member groups are provided which transfer a substrate in zones between adjacent heat treatment plates. At the time when performing a pre-baking treatment in the heat treatment apparatus, the substrate is transferred in order to the heat treatment plates at the same temperature, whereby the heat treatment is dividedly performed on the heat treatment plates. According to the present invention, substrates are subjected to heat treatment along the same route, so that the thermal histories are made uniform among the substrates.

REFERENCES:
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Japanese Office Action dated Jun. 1, 2010. Corresponds with Application No. 2006-034089, with English translation, 8 pages.

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