Substrate treatment method and substrate treatment apparatus

Details Substrate treatment method and substrate treatment apparatus Substrate treatment method and substrate treatment apparatus

2006-01-13

2008-08-19

Zervigon, Rudy (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C134S137000, C134S149000, C156S345510, C118S729000, C118S730000, C118S728000

Reexamination Certificate

active

07413628

ABSTRACT:
A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.

REFERENCES:
patent: 5093550 (1992-03-01), Gerber et al.
patent: 6067727 (2000-05-01), Muraoka
patent: 6683007 (2004-01-01), Yamasaki et al.
patent: 6935638 (2005-08-01), Ivanov et al.
patent: 2002/0153676 (2002-10-01), Noguchi
patent: 2002/0185163 (2002-12-01), Peace et al.
patent: 04-186626 (1992-07-01), None
patent: 09-107023 (1997-04-01), None
patent: 9-107023 (1997-04-01), None
patent: 10249613 (1998-09-01), None
patent: 2001-156039 (2001-06-01), None
patent: 2003-088793 (2003-03-01), None
Machine translation of JP 09-107023, inventor Tatshuhiko, Apr. 1997.
Office Action issued on Jul. 3, 2007 in connection with the Japanese Patent Application No. 2003-083695.

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