Substrate treatment method and substrate treatment apparatus

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Removal of imaged layers

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S331000, C257SE21026, C118S063000

Reexamination Certificate

active

07989156

ABSTRACT:
A substrate treatment apparatus which uniformly forms a fine resist pattern with a desired dimension within a plane of a substrate is disclosed. In a solvent vapor supply unit, a solvent vapor discharge nozzle is provided which can discharge a solvent vapor for swelling a resist pattern while moving above the front surface of a wafer. The wafer for which developing treatment has been finished and on which a resist pattern has been formed is carried into the solvent vapor supply unit, and the solvent vapor discharge nozzle is moved above the front surface of the wafer, so that the solvent vapor discharge nozzle supplies the solvent vapor onto the front surface of the wafer. This uniformly supplies a predetermined amount of solvent vapor to the resist pattern on the front surface of the wafer. As a result, the solvent vapor causes the resist pattern to evenly swell by a predetermined dimension, so that a resist pattern with a desired dimension is finally uniformly formed within the plane of the wafer.

REFERENCES:
patent: 4987854 (1991-01-01), Hall
patent: 5250114 (1993-10-01), Konishi et al.
patent: 5690740 (1997-11-01), Smith
patent: 5769946 (1998-06-01), Kutsuzawa et al.
patent: 5902399 (1999-05-01), Courtenay
patent: 5904301 (1999-05-01), Kajiyama et al.
patent: 6322009 (2001-11-01), Subramanian et al.
patent: 6676757 (2004-01-01), Kitano et al.
patent: 6729041 (2004-05-01), Shindo et al.
patent: 7819076 (2010-10-01), Inatomi
patent: 7875420 (2011-01-01), Inatomi
patent: 2002/0132480 (2002-09-01), Shindo et al.
patent: 2006/0237127 (2006-10-01), Inatomi
patent: 51-150279 (1976-12-01), None
patent: 64-69014 (1989-03-01), None
patent: 07-5695 (1995-01-01), None
patent: 08-234451 (1996-09-01), None
patent: 10-50595 (1998-02-01), None
patent: 2002-217160 (2002-08-01), None
patent: 2005-19969 (2005-01-01), None
patent: WO 98/37575 (1998-08-01), None
patent: WO 2004/109779 (2004-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate treatment method and substrate treatment apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate treatment method and substrate treatment apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate treatment method and substrate treatment apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2718914

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.