Substrate treatment device and substrate transporting method

Details Substrate treatment device and substrate transporting method Substrate treatment device and substrate transporting method

1998-03-12

2001-02-13

Bell, Mark L. (Department: 1755)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C134S018000, C134S021000, C134S031000, C118S729000, C438S905000

Reexamination Certificate

active

06187132

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a substrate treatment device for treating a substrate such as a semiconductor wafer or a LCD substrate, and a transporting method used for the device.
In production of a semiconductor device and a liquid crystal display(LCD), a circuit pattern is formed with a so-called photolithography technology in which a semiconductor wafer or a LCD substrate which serve as a substrate is coated with photo-resist solution to form a resist film, the resist film is exposed according to a circuit pattern, and the resulting film is developed.
In such coating/developing treatment, when a series of treatments are executed on a substrate, transportation of a substrate is required between various treatment units or between a treatment unit and a cassette. In the transporting operation, a transporting arm is normally used. This transporting arm is mainly constituted of an arm body capable of rotation and horizontal and vertical movement when the substrate is transported or carried out to/from a treatment unit or a cassette, and a pad which is a supporting member for supporting a substrate disposed on the arm body.
This transporting arm moves frequently between various treatment units or between a treatment unit and a cassette, and, during the movement, particles such as dust or dirt tend to deposit thereon. In particular, when these particles are adhered on the pad, since the particles adhere on the rear surface of the substrate to be transported thereafter, an unfavorable result will be induced.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a substrate treatment device capable of treating the substrate without depositing particles on a rear surface of a substrate and a substrate transporting method which can be used in such device.
For this, a substrate treatment device of the present invention comprises a transporting arm for transporting a substrate within the treatment device, a supporting member, which is disposed on the transporting arm, for supporting the substrate, and a cleaning mechanism, which is installed in the substrate treatment device, for cleaning the supporting member. Since the substrate treatment device is equipped with the cleaning mechanism for cleaning the supporting member, the supporting member can be cleaned as occasion demands. Therefore, since the substrate always can be kept in a clean state, the particles are prevented from adhering on the rear surface of the substrate.
A substrate transporting method of the present invention comprises a step for cleaning the supporting member before or after the supporting member contacts with the substrate in a transporting process of the substrate with a transporting arm which possesses a supporting member for supporting the substrate during treatment of the substrate. Therefore, during transportation of the substrate, the substrate can be kept in a state in which there is no particle on the supporting member. In consequence, the rear surface of the substrate can be prevented from deposition of the particles during treatment of the substrate.


REFERENCES:
patent: 5695817 (1997-12-01), Tateyama et al.
patent: 07-066171 (1995-03-01), None
patent: 08-241880 (1996-09-01), None

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