Substrate treating system, substrate treating device,...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support

Reexamination Certificate

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Details

C156S345150, C156S345240, C134S113000, C118S730000

Reexamination Certificate

active

08052834

ABSTRACT:
Of process steps of polymer removal in a substrate processing apparatus (3), in a step of discharging and spreading a removal solution to coat a rotating substrate (W), data indicative of the number of revolutions of a substrate, the temperature and flow rate of a removal solution, and removal solution discharge time is collected and a combination thereof is synthetically assessed to detect a processing abnormality. In a pure water discharge step, data indicative of the number of revolutions of a substrate, the flow rate of pure water and pure water discharge time is collected and a combination thereof synthetically assessed to detect a processing abnormality. Thus, a processing abnormality in polymer removal is detected based on a combination of important control elements in important steps largely exerting influence on the results of processing, thereby allowing detection of a processing abnormality with a higher degree of accuracy.

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