Substrate supporting structure for semiconductor processing,...

Details Substrate supporting structure for semiconductor processing,... Substrate supporting structure for semiconductor processing,...

2005-09-09

2010-11-23

Kackar, Ram N. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C156S345510, C118S728000, C118S724000, C361S234000, C279S128000

Reexamination Certificate

active

07837828

ABSTRACT:
A substrate supportingstructure (50) for semiconductor processing, comprising a mounting table (51) for placing a processed substrate (W) disposed in a processing chamber (20), wherein temperature control spaces (507) for storing the fluid used as a heat exchange medium are formed in the mounting table (51), a conductive transmission path (502) is disposed to lead a high frequency power to the mounting table (51), and flow channels (505, 506) feeding or discharging the heat exchange medium fluid to or from the temperature control spaces (507) are formed in the transmission path (502).

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