Substrate support element for an electrochemical plating cell

Details Substrate support element for an electrochemical plating cell Substrate support element for an electrochemical plating cell

2007-05-08

2007-05-08

Bell, Bruce F. (Department: 1746)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S297060, C204S297070, C204S297080, C204S297090, C204S286100, C204S287000, C204S288000, C204S279000

Reexamination Certificate

active

10879668

ABSTRACT:
A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.

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