Wave transmission lines and networks – Long line elements and components – Strip type
Reexamination Certificate
2006-04-25
2006-04-25
Harvey, Minsun (Department: 2828)
Wave transmission lines and networks
Long line elements and components
Strip type
C372S043010, C372S046010, C372S050100
Reexamination Certificate
active
07034641
ABSTRACT:
A substrate structure useful for photonics modules comprises a high-thermal-conductivity (e.g., greater than 20 W/m°K) substrate body with a low-thermal-conductivity (e.g., less than 5 W/m°K) dielectric layer overlying at least a portion of the substrate body. Patterned metal layers for electrical circuit connections can be located on the dielectric layer, on the substrate body (under the dielectric layer, on regions of exposed substrate body, or both), or on both. Where the laser is driven at high frequencies (e.g., 2.5 Gbits/sec), the dielectric layer material and thickness can be chosen to provide desired RF behavior. For example, the electrodes and dielectric layer can be configured to provide a transmission line with the desired impedance. Further, where it is desired to solder a component to the substrate, a heater resistor can be formed on the dielectric layer, thereby facilitating soldering the component.
REFERENCES:
patent: 5577021 (1996-11-01), Nakatani et al.
patent: 5773875 (1998-06-01), Chan
patent: 5780314 (1998-07-01), Chan
patent: 5960014 (1999-09-01), Li et al.
patent: 6174614 (2001-01-01), Yushio et al.
patent: 6271579 (2001-08-01), Going et al.
patent: 6477302 (2002-11-01), Tatoh
patent: 6627992 (2003-09-01), Ammar
Bjorn Richard D.
Chuyanov Vadim
Clarke Robert A.
Kusnadi Frans
Major John Cameron
Flores-Ruiz Delma R.
Harvey Minsun
K2 Optronics, Inc.
Townsend and Townsend / and Crew LLP
LandOfFree
Substrate structure for photonic assemblies and the like... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate structure for photonic assemblies and the like..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate structure for photonic assemblies and the like... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3559396