Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-03-12
1999-12-14
Fahmy, Wael M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257784, 257786, 257778, 257780, 361774, 361777, 174261, H01L 2166, H01L 2934
Patent
active
060021721
ABSTRACT:
An adhesion pad for adhering a semiconductor chip or a ball grid array module to a supporting substrate includes a stepped or tapered structure. The structure is composed of at least one solder wettable metal or alloy layer having solder deposited thereon. The stepped or tapered structure prevents a fatigue crack from propagating in the X-Y plane above the adhesion pad.
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Desai Kishor V.
Sarkhel Amit K.
Duong Hung Van
Fahmy Wael M.
Fraley Lawrence R.
International Business Machines - Corporation
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