Substrate structure

Details Substrate structure Substrate structure

2011-06-28

2011-06-28

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S705000, C361S707000, C361S719000, C349S062000, C362S627000, C174S521000

Reexamination Certificate

active

07969741

ABSTRACT:
It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure20of the first embodiment is provided with a substrate21, a plurality of electronic components22mounted along the substrate21, and a resin part25that covers the electronic components22and is in close contact with the substrate21. In the substrate structure20, the resin part25is provided with a reinforcing heat discharge layer26covering the electronic components22and having a heat conductivity and a reinforcing property and a shield layer27covering the reinforcing heat discharge layer26, and a surface o28of the shield layer27is formed into a predetermined shape corresponding to a surface structure of the display device30adjacent to the resin part25.

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