Substrate soldering in a reducing atmosphere

Details Substrate soldering in a reducing atmosphere Substrate soldering in a reducing atmosphere

1991-03-21

1992-09-08

Rowan, Kurt

Metal fusion bonding

Process

Plural joints

2281801, B23K 3102

Patent

active

051451042

ABSTRACT:
An improved method and apparatus for making solder connections from input/output connecting pins to the circuitry on a pinned metallized ceramic substrate. A solder preform in the shape of a sphere provides the correct volume of solder. These spheres are held in position at each desired joint by a templet. The substrate, solder sphere and templet assembly is passed through a furnace in a reducing atmosphere and at a temperature to facilitate solder reflow and wetting, thus creating a sound mechanical and electrical connection between the pin and its portion of the circuitry. The method and apparatus of the invention provides joints have a high degree of reliability such that all connections are made to acceptable soldering standards, none lacking integrity. Only harmless by-products are produced in the practice of the invention, and no residue is produced which requires cleaning by means of chemical solvents and therefore is environmentally superior.

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