Substrate removal method and mechanism for effecting the method

Details Substrate removal method and mechanism for effecting the method Substrate removal method and mechanism for effecting the method

1994-12-27

1996-09-03

Fleming, Fritz

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

361213, H02N 1300

Patent

active

055529550

ABSTRACT:
A method for rapidly, reliably, and safely removing a substrate from an electrostatic clamping electrode and a mechanism for effecting the method. The method comprises forming a gap between an electrode and a substrate which had been made to hold onto the electrode by electrostatic clamping to increase the electrostatic potential between the substrate and the electrode, generating a DC-glow-discharge in the vicinity of the substrate according to Paschen's law, and removing the substrate from the electrode after eliminating the static charge from the substrate using gas molecules charged by the DC-glow-discharge. A mechanism for effecting the method comprises a means for introducing a gas, a protruding means, a means for controlling the pressure, a sequencer for sequentially activating them, and a lifting mechanism for adjusting the height of the protruding means to the gap distance necessary for generating a DC-glow-discharge between the substrate and the electrode.

REFERENCES:
patent: 4184188 (1980-01-01), Briglia
patent: 4384918 (1983-05-01), Abe
patent: 4399016 (1983-08-01), Tsukada et al.
patent: 4480284 (1984-10-01), Tojo et al.
patent: 4502094 (1985-02-01), Lewin et al.
patent: 4554611 (1985-11-01), Lewin
patent: 4645218 (1987-02-01), Ooshio et al.
patent: 4665463 (1987-05-01), Ward et al.
patent: 4692836 (1987-09-01), Suzuki
patent: 4724510 (1988-02-01), Wicker et al.
patent: 4962441 (1990-10-01), Collins
patent: 4990229 (1991-02-01), Campbell et al.
patent: 5055964 (1991-10-01), Logan et al.
patent: 5099571 (1992-03-01), Logan et al.
patent: 5103367 (1992-04-01), Horwitz et al.
patent: 5104834 (1992-04-01), Watanabe et al.
patent: 5122251 (1992-06-01), Campbell et al.
patent: 5151845 (1992-09-01), Watanabe et al.
patent: 5160152 (1992-11-01), Toraguchi et al.
patent: 5166856 (1992-11-01), Liporace et al.
patent: 5179498 (1993-01-01), Hongoh et al.
patent: 5191506 (1993-03-01), Logan et al.
patent: 5207437 (1993-05-01), Barnes et al.
patent: 5213349 (1993-05-01), Elliott
patent: 5221403 (1993-06-01), Nozawa et al.
patent: 5221450 (1993-06-01), Hattori et al.
patent: 5250137 (1993-10-01), Arami et al.
patent: 5255153 (1993-10-01), Nozawa et al.
patent: 5310453 (1994-05-01), Fukasawa et al.
patent: 5315473 (1994-05-01), Collins et al.
patent: 5350479 (1994-09-01), Collins et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
Electrostatic Clamping Applied to Semiconductor Plasma Processing; J. F. Daviel and L. Peccoud; J. Electrochem, Soc., vol. 140, NO. 11, Nov. 1993.
Relationship between Electrical Rsistivity and Electrostatic force of Allumina Electrostatic Chuck; Toshiya Watanabe et al.; Jpn. J. Appl. Phys. vol. 32 (1993) pp. 864-871, Part1, NO. 2, Feb. 1993.
Electrostatec Force and Absorption current of Alumina Electrostatic Chuck; Toshiya Watanabe et al.; Jpn. J. Appl. Phys. vol. 31 (1992) pp. 2145-2150; Part 1, No. 7, Jul. 1992.
Neutralization of Static Electricity by Using Ionizing of Gas Molecules; Hitoshi Inaba et al.; pp. 16-22; Ultra Clean Technology, 1994.

Affiliated with

Also associated with

Rating

Substrate removal method and mechanism for effecting the method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate removal method and mechanism for effecting the method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate removal method and mechanism for effecting the method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1955727