Substrate removal from polishing tool

Details Substrate removal from polishing tool Substrate removal from polishing tool

2006-07-25

2006-07-25

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S388000

Reexamination Certificate

active

07081042

ABSTRACT:
Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad.

REFERENCES:
patent: 5899801 (1999-05-01), Tolles et al.
patent: 5964653 (1999-10-01), Perlov et al.
patent: 6132294 (2000-10-01), Lin
patent: 6159079 (2000-12-01), Zuniga et al.
patent: 6183354 (2001-02-01), Zuniga et al.
patent: 6305677 (2001-10-01), Lenz
patent: 6422927 (2002-07-01), Zuniga
patent: 6450868 (2002-09-01), Zuniga et al.
patent: 6558228 (2003-05-01), Cheng et al.
patent: 6857945 (2005-02-01), Chen et al.
patent: 2003/0079691 (2003-05-01), Shang et al.
U.S. Appl. No. 10/810,784, filed Mar. 26, 2004, Chen et al., 17 pages.

Affiliated with

Also associated with

Rating

Substrate removal from polishing tool does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate removal from polishing tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate removal from polishing tool will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3607229