Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Patent
1995-01-23
1996-10-08
Dang, Thi
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
216 75, 216 58, 21912169, B08B 500
Patent
active
055628400
ABSTRACT:
There is disclosed a substrate reclaim method comprising directing laser energy at a coating covering a part of an outer surface of a substrate, wherein the outer surface has a shiny finish, thereby removing with the laser energy all of the coating on the outer surface and etching with the laser energy a portion of the outer surface to change the etched outer surface portion from a shiny finish to a matte finish.
REFERENCES:
patent: 4671848 (1987-06-01), Miller et al.
patent: 4841611 (1989-06-01), Kusaba et al.
patent: 4877644 (1989-10-01), Wu et al.
patent: 4947023 (1990-08-01), Minamida et al.
patent: 4972061 (1990-11-01), Duley et al.
patent: 5091278 (1992-02-01), Teuscher et al.
patent: 5120628 (1992-06-01), Mammino et al.
patent: 5164567 (1992-11-01), Gettemy
patent: 5167987 (1992-12-01), Yu
patent: 5324608 (1994-06-01), Gerriets et al.
patent: 5378315 (1995-01-01), Hendrix et al.
Klein Alfred O.
Schmitt Peter J.
Swain Eugene A.
Wilbert John J.
Dang Thi
Soong Zosan S.
Xerox Corporation
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