Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-10-08
2000-12-12
Bueker, Richard
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
134 12, 118723E, C23F 102
Patent
active
061593338
ABSTRACT:
An apparatus for processing substrates that is configured for a cleaning operation by loading a cleaning process wafer onto the susceptor before forming a cleaning plasma in the processing chamber. In one embodiment, a ceramic wafer is chosen to have a dielectric value sufficient to alter the electromagnetic field of the plasma, and spreads the plasma away from the susceptor during a cleaning operation, thus reducing damage to the susceptor. The plasma may be directed towards the walls of the chamber to reduce chamber cleaning time.
REFERENCES:
patent: 4786352 (1988-11-01), Benzing
patent: 5000113 (1991-03-01), Wang et al.
patent: 5024748 (1991-06-01), Fujimura
patent: 5041311 (1991-08-01), Tsukune et al.
patent: 5098245 (1992-03-01), Toro-Lira et al.
patent: 5158644 (1992-10-01), Cheung et al.
patent: 5240555 (1993-08-01), Kilburn
patent: 5269881 (1993-12-01), Sekiya et al.
patent: 5304248 (1994-04-01), Cheng et al.
patent: 5366585 (1994-11-01), Robertson et al.
patent: 5405491 (1995-04-01), Shahvandi et al.
patent: 5555717 (1996-09-01), Zhao et al.
patent: 5810937 (1998-09-01), Gupta et al.
Gupta Anand
Murugesh Laxman
Ponnekanti Srihari
Rimple Gana A.
Applied Materials Inc.
Bueker Richard
Fieler Erin
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