Substrate processing system and substrate processing method

Details Substrate processing system and substrate processing method Substrate processing system and substrate processing method

2007-07-17

2007-07-17

Lund, Jeffrie R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C156S345280, C156S345290, C156S345320

Reexamination Certificate

active

10602041

ABSTRACT:
A substrate processing system is provided with an ozone generator capable of generating an ozone-containing gas by discharging electricity in an oxygen-containing gas, and a plurality of processing chambers each capable of holding substrates therein to process the substrates by the ozone-containing gas supplied thereto. A flow regulator control an oxygen-containing gas supplied to the ozone generator. A controller controls the flow regulator to control the flow rate of the ozone-containing gas to be supplied to the processing chamber or chambers from the ozone generator through the control of the flow rate of the oxygen-containing gas supplied to the ozone generator.

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