Substrate processing method and substrate processing apparatus

Details Substrate processing method and substrate processing apparatus Substrate processing method and substrate processing apparatus

2007-06-05

2010-11-23

Duda, Kathleen (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Removal of imaged layers

C430S311000, C430S331000

Reexamination Certificate

active

07838206

ABSTRACT:
A substrate processing method according to the present invention is to be applied for stripping and removing, from the surface of a substrate, a resist no longer required. According to the substrate processing method, a resist stripping liquid is supplied to the center portion of the surface of a substrate held by a substrate holding unit. An organic solvent liquid is supplied to the peripheral edge portion of the surface of the substrate held by the substrate holding unit.

REFERENCES:
patent: 5634980 (1997-06-01), Tomita et al.
patent: 2004/0000322 (2004-01-01), Verhaverbeke
patent: 2005/0205115 (2005-09-01), Okuyama et al.
patent: 1 296 358 (2003-03-01), None
patent: 6-291098 (1994-10-01), None
patent: 10-79334 (1998-03-01), None

Affiliated with

Also associated with

Rating

Substrate processing method and substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing method and substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing method and substrate processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4187360